Call for Sponsorship

The Organizing Committee for the 2019 IEEE International Conference on Multimedia & Expo (ICME 2019) cordially invites you to participate as a sponsor and/or exhibitor at the conference to be held in Shanghai, China. You will have the unique opportunity to promote your company and market your brand to influential stakeholders in the multimedia community.

Since 2000, ICME has been the flagship multimedia conference sponsored by four IEEE societies, with about 500 participants. It serves as a forum to promote the exchange of the latest advances in multimedia technologies, systems, and applications from both the research and development perspectives of the circuits and systems, communications, computer, and signal processing communities. In 2019, an Exposition of multimedia products, prototypes and animations will be held in conjunction with the conference.

Sponsor participation at ICME 2019 will give your organization a unique opportunity to increase visibility, promote your brand and showcase the latest advances of your research to an interested, highly qualified and international audience from a wide range of backgrounds, expertise and influence.

ICME 2019 welcomes all forms of support from industry and research institutions. It offers a variety of options for sponsor participation, which include different levels of sponsorship, contribution to grants, awards and events, as well as special options tailored to the sponsor’s specific interests. The sponsorship program includes benefits such as printing the company’s logo on the webpage, conference handbook and proceedings, and the opportunity to distribute brochures and/or other materials to delegates.

We look forward to welcoming you to Shanghai and encourage you to explore the benefits of participating as a sponsor and/or exhibitor and secure your preferred options.

General Sponsorship Program

Diamond Level ($30,000 and above)

Platinum Level ($20,000)

Gold Level ($10,000)

Silver Level ($5,000)

Sponsorship Opportunities

Sponsorship of Grand Challenges ($3,000 each, logo on conference website)

Industry Partner in the Students’ Luncheon ($3,000)

Sponsorship of Awards, Events, or Gifts ($1500 each, logo on conference website)

Contact

Sponsorship Chairs

Le Dong
University of Electronic Science and Technology of China, China
Yongdong Zhang
University of Science and Technology of China, China
Junsong Yuan
State University of New York, Buffalo, USA